Waste Management

Download Semiconductor Industry: Wafer Fab Exhaust Management by J. Michael Sherer PDF

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By J. Michael Sherer

Given the myriad exhaust compounds and the corresponding difficulties that they could pose in an exhaust administration method, the right kind selection of such structures is a fancy job. proposing the basics, technical information, and basic strategies to real-world difficulties, Semiconductor undefined: Wafer Fab Exhaust administration bargains useful assistance on identifying a suitable method for a given program. utilizing examples that offer a transparent knowing of the innovations mentioned, Sherer covers facility structure, aid amenities operations, and semiconductor strategy apparatus, by means of exhaust kinds and demanding situations. He studies exhaust point-of-use units and exhaust line requisites wanted among strategy gear and the centralized exhaust approach. The e-book comprises details on rainy scrubbers for a centralized acid exhaust process and a centralized ammonia exhaust method and on centralized apparatus to regulate unstable natural compounds. It concludes with a bankruptcy dedicated to emergency releases and a separate bankruptcy of examples illustrating those platforms in use. Drawing at the author's two decades of event, the ebook exhibits you ways to customise suggestions particular in your wishes, remedy present difficulties, and forestall destiny matters on your exhaust administration platforms.

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Other compounds, such as nitric acid and hydrogen fluoride, may also be in this centralized exhaust system, so design of the centralized abatement system should consider this. 4. , arsine and phosphine). 5. Exhaust system for silane gas cabinets: allows for safe release of silane in case of emergency release. 6. Exhaust system for toxic gas cabinets: in case of emergency release, usually with abatement system or with dilution system. Some of the above centralized exhaust systems and corresponding centralized abatement systems will be discussed in later chapters.

Aluminum metal etch Tungsten chemical vapor deposition (CVD) Tungsten silicide CVD Nitride CVD Oxynitride CVD Low-pressure chemical vapor deposition (LPCVD) nitride Tetraethylorthosilicate (TEOS)-based oxide CVD (mainly resulting from TEOS condensation and later reaction with chamber cleaning gas by-products) h. Titanium nitride CVD (using titanium tetrachloride and ammonia) Heating the exhaust line to minimize particulate deposition can be used. 2. Prevent exhaust fires and explosions. , silane) can be used in semiconductor process equipment.

The POU device supplier can suggest POU device technology solutions to the future POU device owner for his or her selection. The future POU device owner should utilize POU device suppliers that have the best POU device technologies. Some suggested POU supplier expectations that the future POU device owner should expect from the POU device supplier are detailed in the following sections. 1 Understanding Semiconductor Fab Processes, Materials, and Environmental, Health, and Safety The POU device supplier needs to understand the specific wafer fab operations, process equipment, process materials, surrounding process pump and exhaust line requirements, and wafer fab environmental, health, and safety requirements.

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